Semiconductor device e.g. acceleration sensor, for vehicle, has semiconductor chip with trench present within connecting edge if bump edge present at edge section of contact surface of contact area and bump is defined as connecting edge

摘要

The device has semiconductor chips (10, 20) provided with semiconductor substrates (11, 21) e.g. silicon-on-insulator (SOI) substrates, and contact areas (12, 22) that are arranged on the semiconductor substrates, respectively. A bump (30) is arranged on the contact areas and bonds the semiconductor chips as flip chips. One chip (10) has a trench (13) forming a circle within a connecting edge (14) if an edge of the bump present at an outer edge section of a contact surface of one contact area (12) and the bump is defined as the connecting edge.