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Contact connector surface for semiconductor component, has heater structure electrically isolated from surface and including metallic conducting paths, which surround surface at its edges and arranged meander shaped under surface
Contact connector surface for semiconductor component, has heater structure electrically isolated from surface and including metallic conducting paths, which surround surface at its edges and arranged meander shaped under surface
The connector surface has a heater structure (1) for testing electrical connection between the surface and an electrical connecting unit. The heater structure is electrically isolated from the surface and includes metallic conducting paths (10). The conducting paths surround the surface at its edges and are arranged meander shaped under the surface. The heater structure is formed from insulation and metal layers sequence. An independent claim is also included for a method of manufacturing and operating a contact connector surface.
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