首页> 外国专利> Contact connector surface for semiconductor component, has heater structure electrically isolated from surface and including metallic conducting paths, which surround surface at its edges and arranged meander shaped under surface

Contact connector surface for semiconductor component, has heater structure electrically isolated from surface and including metallic conducting paths, which surround surface at its edges and arranged meander shaped under surface

机译:半导体元件的接触连接器表面,具有与表面电隔离的加热器结构,并包括金属导电路径,该金属导电路径在其边缘围绕表面并在表面下排列成曲折状

摘要

The connector surface has a heater structure (1) for testing electrical connection between the surface and an electrical connecting unit. The heater structure is electrically isolated from the surface and includes metallic conducting paths (10). The conducting paths surround the surface at its edges and are arranged meander shaped under the surface. The heater structure is formed from insulation and metal layers sequence. An independent claim is also included for a method of manufacturing and operating a contact connector surface.
机译:连接器表面具有加热器结构(1),用于测试表面和电连接单元之间的电连接。加热器结构与表面电隔离并且包括金属导电路径(10)。导电路径在其边缘处围绕表面,并且在表面下方布置成曲折形。加热器结构由绝缘层和金属层序列形成。还包括一种用于制造和操作接触连接器表面的方法的独立权利要求。

著录项

  • 公开/公告号DE102005009164A1

    专利类型

  • 公开/公告日2006-09-14

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE20051009164

  • 发明设计人 MARTIN ANDREAS;PAPE HEINZ;

    申请日2005-02-25

  • 分类号H01L23/50;H05B3/26;H05B3/02;G01R31/28;

  • 国家 DE

  • 入库时间 2022-08-21 21:20:25

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