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Lead frame structure with opening or groove for a flip chip in a leaded molded package
Lead frame structure with opening or groove for a flip chip in a leaded molded package
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机译:带开口或凹槽的引线框架结构,用于引线模塑封装中的倒装芯片
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摘要
A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die including a first surface and a second surface, and a leadframe structure having a die attach region and a plurality of leads extending away from the die attach region. The die attach region includes one or more apertures. A molding material is around at least portions of the die attach region of the leadframe structure and the semiconductor die. The molding material is also within the one or more apertures.
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