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Magnetron-driven atomization and sputtering coating process predetermines target atomization condition and modifies magnet array rotation

机译:磁控管驱动的雾化和溅射镀膜工艺可确定目标雾化条件并改变磁体阵列的旋转

摘要

In a magnetron-driven atomization and sputtering coating process, the coating particles are directed at the substrate surface by an array of rotating magnets. In the process, the atomization condition of the target is first determined, and the magnetic array speed of rotation regulated accordingly. The atomization condition is determined in accordance with the residual service life.
机译:在磁控管驱动的雾化和溅射涂层工艺中,涂层颗粒通过旋转磁体阵列直接对准基板表面。在此过程中,首先确定目标的雾化条件,并据此调节磁阵列的旋转速度。根据剩余使用寿命确定雾化条件。

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