Cooling system for IC (integrated circuit) chips used in e.g. personal computer, has heat sink connected to heat exchanger by connecting tubes through which liquid from pump circulates to cool IC chip

摘要

The system includes a heat sink (23) for absorbing the heat coming from an IC chip (21), and a heat exchanger (31) for dissipating the heat from the heat sink. The heat exchanger is made of heat conductive material containing metal and crystalline carbon. At least two connecting tubes (251) interconnect the heat sink to the heat exchanger. A pump (25) is used to circulate liquid in the connecting tubes between the heat sink and the heat exchanger. An independent claim is included for setting-up the heat exchanger.