Integrated circuit i.e. processor, cooling system for personal computer, has visualization unit arranged opposite to opening formed in heat sink and allowing visualization of coolant during passage of coolant above chip

摘要

The system (S) has a circulating unit arranged above a chip (1) i.e. die, for circulating coolant in a heat pipe and a heat sink (3). The heat pipe is thermally coupled to the chip, and sends the coolant from the chip to the heat sink. The heat sink dissipates, by natural convection, heat generated by the chip. A visualization unit allows visualization of the coolant during passage of the coolant above the chip. The visualization unit is arranged opposite to an opening formed in the heat sink. A support piece is made of transparent or translucent material. An independent claim is also included for a method for cooling an integrated circuit.