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A method for judging the quality of a lead-free solder material, and method for surge - soldering

机译:一种无铅焊料材料质量的判断方法和电涌焊接方法

摘要

There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process. In the present invention, a differential thermal analysis curve of a sample of the lead-free solder material is obtained by utilizing a differential thermal analysis method, and thereby a quality of the lead-free solder material used for a flow soldering process is estimated based on the obtained differential thermal analysis curve. IMAGE
机译:提供一种可以方便地估计用于流焊工艺的无铅焊料材料的质量的方法。在本发明中,通过利用差热分析方法获得无铅焊料材料的样品的差热分析曲线,从而基于流式焊接工艺来估计无铅焊料材料的质量。根据获得的差热分析曲线。 <图像>

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