NICKEL-PLATING SOLUTION AND METHOD FOR MANUFACTURING ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To provide a nickel-plating solution which minimizes the growth of a plating film, imparts the plated film satisfactory smoothness, and adequately dissolves an anode therein.;SOLUTION: The nickel-plating solution includes a nickel salt mainly containing nickel sulfate, a halogen compound such as nickel chloride, and a pH buffer such as boric acid; has a pH adjusted to 2.2 to 5.5; contains nickel ions in a molar concentration (x) of 1.71 mol/L or higher; and contains halide ions so that a molar concentration ratio x/y of the molar concentration (x) of the nickel ions to the molar concentration (y) of the halide ions can be 3.0x/y≤10.0. This method for manufacturing electronic parts comprises the steps of: electrolytically plating external electrodes 6a and 6b with nickel in the nickel plating bath to form nickel films 7a and 7b having satisfactory smoothness thereon; and then electrolytically plating the external electrodes with tin to form tin films 8a and 8b on the nickel films 7a and 7b.;COPYRIGHT: (C)2008,JPO&INPIT