FILM DEPOSITION METHOD BY PVD AND TARGET FOR FILM DEPOSITION USED FOR PVD

摘要

PROBLEM TO BE SOLVED: To provide a film deposition method by PVD (Physical Vapor Deposition) and a target for film deposition by which the in-plane uniformity of film deposition rate is improved and a stable film deposition is fulfilled by securely controlling a sputter region upon film deposition in a target composed of a powdery target.;SOLUTION: A film deposition apparatus includes a processing chamber internally having a reduced-pressure space for film deposition process to be carried out therein, a base material holding member for holding a base material to be subjected to the film deposition process, a target support member for supporting a target thereon, and a power supply unit for applying electric power to the target support member to generate a plasma in the reduced-pressure space. In the film deposition apparatus, a film deposition process is carried out by using the target, which has a recess portion in its surface and in which a powder target formed of a powder material is placed in an inner surface of the recess portion. Thus, the in-plane uniformity of deposition rate is improved and a stable film deposition is fulfilled.;COPYRIGHT: (C)2007,JPO&INPIT