FILM DEPOSITION SYSTEM FOR BOTH PVD/CVD, AND FILM DEPOSITION METHOD USING THE SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a film deposition system for both PVD (Physical Vapor Deposition)/CVD (Chemical Vapor Deposition) in which the sticking of a film from a PVD system to a CVD system is prevented, and the influence of the PVD system on the movement of the CVD system is prevented, and to provide a film deposition method in which productivity is increased using the system.;SOLUTION: In the film deposition system for both PVD/CVD where a substrate 2, a PVD system 3 and a CVD system 4 are arranged inside a vacuum chamber 1, and PVD film deposition 28 and CVD film deposition 27 are performed to the substrate 2, a shielding device 9 preventing the sticking of an evaporated material from the PVD system 3 to the CVD system 4 is provided.;COPYRIGHT: (C)2004,JPO&NCIPI