METHOD FOR SPLITTING SUBSTRATE AND SPLITTING APPARATUS

摘要

PROBLEM TO BE SOLVED: To efficiently eliminate fragments that result from cut-based breaking of a substrate and are about to stick to the substrate when the substrate is split by cut-based breaking to improve yield.;SOLUTION: In a water case 51, water is kept flowable as a result of constant supply and discharge, a wafer 1 is placed on a chuck table 61 and is submerged, and a dicing frame 6 which is fitted to the wafer 1 via a dicing tape 5, is pushed down. This stretches out the dicing tape 5, which breaks the wafer 1 along splitting preparation lines 2 along which an internal reforming layer is formed in advance by laser exposure. Fragments resulting from cut-based breaking are released into water to be eliminated from the wafer 1 to prevent the fragments from sticking to the wafer 1.;COPYRIGHT: (C)2007,JPO&INPIT