GLASS-SEALED LIGHT EMITING ELEMENT, CIRCUIT BOARD WITH GLASS-SEALED LIGHT EMITTING ELEMENT, METHOD OF MANUFACTURING GLASS-SEALED LIGHT EMITTING EELEMENT, AND GLASS-SEALED LIGHT EMITTING ELEMENT MOUNTING METHOD

摘要

PROBLEM TO BE SOLVED: To seal a diode chip with a glass material.;SOLUTION: A glass-sealed light emitting element comprises a light emitting diode chip and a glass member adhered to at least a part of the surface of the light emitting diode chip. The glass member has a curved surface making at least a part of its surface form. The curved surface is preferably a part of a sphere or ellipsoid of revolution. The surface form of the glass member is composed of a spherical part and a flat part, and the diode chip is disposed preferably on the flat part.;COPYRIGHT: (C)2007,JPO&INPIT