COMPOSITION FOR MOLDING UNDERCOAT LAYER FOR TIN FILM, UNDERCOAT LAYER FOR TIN FILM, AND TIN-FILM-COATED RESIN MOLDING

摘要

PROBLEM TO BE SOLVED: To provide a composition for molding an undercoat layer for a tin film, which is capable of easily forming an undercoat layer being excellent in adhesion to tin film and good in other properties and film smoothness.;SOLUTION: The composition for molding an undercoat layer for a tin film comprises (A) 20 to 40 mass% urethane (meth)acrylate obtained by reacting a polyester diol obtained by reacting (a1) adipic acid with (a2) at least one diol selected from 2 to 6C alkane diols with (a3) tolylene diisocyanate or isophorone diisocyanate and (a4) a hydroxyl-containing (meth)acrylic ester, (B) 45 to 79.9 mass% (meth)acrylate (except compound (A)) having at least one (meth)acryloyl group in the molecule, and (C) 0.1 to 15 mass% photopolymerization initiator.;COPYRIGHT: (C)2007,JPO&INPIT