首页> 外国专利> METHOD FOR REDUCING SURFACE-TACKING PROPERTY OF CURED PRODUCT OF SILICONE RUBBER, LIQUID SILICONE RUBBER COMPOSITION FOR SEALING SEMICONDUCTOR, SILICONE RUBBER-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SEMICONDUCTOR DEVICE

METHOD FOR REDUCING SURFACE-TACKING PROPERTY OF CURED PRODUCT OF SILICONE RUBBER, LIQUID SILICONE RUBBER COMPOSITION FOR SEALING SEMICONDUCTOR, SILICONE RUBBER-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SEMICONDUCTOR DEVICE

机译:降低硅橡胶固化产物的表面粘结性能的方法,用于密封半导体的液态硅橡胶组合物,硅橡胶密封的半导体装置及制造半导体装置的方法

摘要

PPROBLEM TO BE SOLVED: To provide a method for reducing surface-tacking property while stabilizing the characteristics of a cured product of a silicone rubber in a flexible rubber type as an elastomer with time. PSOLUTION: The method for reducing the surface-tacking property of the cured product of the silicone rubber comprises covering the surface of the cured product of a curable silicone rubber composition having 1.0 molar ratio of a hydrogen atom bound with a silicon atom to an alkenyl group bound with the silicon atom in the composition, and providing the cured product having 20 type A hardness provided by JIS K6253, with a curable silicone resin providing a cured product having 30 type D hardness provided by JIS K6253, and curing the silicone resin to provide a cured resin layer having 0.5 mm thickness. PCOPYRIGHT: (C)2007,JPO&INPIT
机译:

要解决的问题:提供一种方法,该方法用于在降低表面粘性的同时,随着时间稳定作为弹性体的柔性橡胶类硅橡胶的固化产物的特性。

解决方案:用于降低硅橡胶的固化产物的表面粘性的方法包括:覆盖具有1.0摩尔比的与硅原子结合的氢原子的可固化硅橡胶组合物的固化产物的表面与组合物中与硅原子键合的烯基,提供由JIS K6253提供的A型硬度为20的固化物,和提供由JIS K6253提供的D型硬度为30的固化物的固化性硅树脂。树脂以提供具有0.5mm厚度的固化树脂层。

版权:(C)2007,日本特许厅&INPIT

著录项

  • 公开/公告号JP2007099835A

    专利类型

  • 公开/公告日2007-04-19

    原文格式PDF

  • 申请/专利权人 SHIN ETSU CHEM CO LTD;

    申请/专利号JP20050288916

  • 发明设计人 KASHIWAGI TSUTOMU;SHIOBARA TOSHIO;

    申请日2005-09-30

  • 分类号C08J7/04;H01L23/29;H01L23/31;H01L27/14;H04N5/225;

  • 国家 JP

  • 入库时间 2022-08-21 21:13:21

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