首页> 外国专利> Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device

Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device

机译:降低硅橡胶固化物的表面粘性的方法,用于密封半导体的液态硅橡胶组合物,硅橡胶密封的半导体器件以及制造半导体器件的方法

摘要

A method of reducing surface tackiness of a silicone rubber cured product is provided. The method includes coating the surface of a cured product of a curable silicone rubber composition, which has a molar ratio within the composition of hydrogen atoms bonded to silicon atoms relative to alkenyl groups bonded to silicon atoms of 1.0 or greater, and which, following curing, exhibits a type A hardness prescribed in JIS K6253 of no more than 20, with a curable silicone resin layer which, following curing, exhibits a type D hardness prescribed in JIS K6253 of 30 or greater; and subsequently curing the silicone resin to form a cured resin layer with a thickness of no more than 0.5 mm. Adhesion of dirt to the surface can be prevented.
机译:提供了一种降低硅橡胶固化产物的表面粘性的方法。该方法包括涂覆可固化的硅橡胶组合物的固化产物的表面,该组合物在与硅原子键合的氢原子相对于与硅原子键合的烯基的组成内的摩尔比为1.0或更大,并且在固化之后,其具有的JIS K6253规定的A型硬度不超过20,并且具有可固化的有机硅树脂层,其固化后具有JIS K6253规定的D型硬度为30或更大;然后固化有机硅树脂以形成厚度不超过0.5mm的固化树脂层。可以防止灰尘附着在表面上。

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