首页>
外国专利>
HOLDING TABLE, PROCESSING DEVICE OF HELD ARTICLE AND PROCESSING DEVICE OF SEMICONDUCTOR WAFER
HOLDING TABLE, PROCESSING DEVICE OF HELD ARTICLE AND PROCESSING DEVICE OF SEMICONDUCTOR WAFER
展开▼
机译:保持台,焊接工件的加工装置和半导体晶片的加工装置
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To provide a holding table constituted simple and capable of holding a held article regardless of size and shape, restraining electric power for working, etc. and reducing cost, a processing device of the held article and a processing device of a semiconductor wafer.;SOLUTION: This holding table is furnished with a base 40 provided on a processing table 3 of a back grinding device 1, a dent hole 41 formed recessed in a flat surface circular shape on a surface of the base 40, a deformable holding layer 43 to closely hold the semiconductor wafer W free to connect and disconnect by covering the dent hole 41 and an exhaust passage 44 to exhaust air in the dent hole 41 covered with the holding layer 43 outside in accordance with driving of a vacuum pump 45. It is possible to continuously adhere the semiconductor wafer W of a small bore diameter as the air does not leak even when the semiconductor wafer of less than the set size, etc. is used as it is by setting a size of the holding layer 43 so as to correspond with the size of the semiconductor wafer W.;COPYRIGHT: (C)2007,JPO&INPIT
展开▼