首页> 外国专利> METHOD FOR JOINING ANODE, METHOD FOR MANUFACTURING ELECTROSTATIC ACTUATOR, ELECTROSTATIC ACTUATOR, METHOD FOR MANUFACTURING DROPLET DELIVERY HEAD, DROPLET DELIVERY HEAD AND DROPLET DELIVERY APPARATUS

METHOD FOR JOINING ANODE, METHOD FOR MANUFACTURING ELECTROSTATIC ACTUATOR, ELECTROSTATIC ACTUATOR, METHOD FOR MANUFACTURING DROPLET DELIVERY HEAD, DROPLET DELIVERY HEAD AND DROPLET DELIVERY APPARATUS

机译:接合阳极的方法,静电致动器的制造方法,静电致动器,液滴输送头的制造方法,液滴输送头和液滴输送装置

摘要

PROBLEM TO BE SOLVED: To provide an anode joining method which enables an excellent joining strength to be obtained by inhibiting the void at a joining interface in a short time without needing an apparatus modification or a jig fabrication to inhibit the void.;SOLUTION: The anode joining method includes a process of making a glass substrate 2a through which an atmospheric air communicating hole 16 is formed and a silicon substrate 1a wherein a groove 8 for discharging a bubble which communicates with the atmospheric air communicating hole 16 is formed along with a dicing line for formation of an individual chip stuck and piled up and a process of joining these substrates each other by applying a voltage to these substrates.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种阳极接合方法,该方法能够通过在短时间内抑制接合界面处的空隙而获得优异的接合强度,而无需进行设备改造或通过夹具制造来抑制空隙。阳极接合方法包括以下步骤:制造玻璃基板2a,通过该玻璃基板2a形成大气连通孔16;以及硅基板1a,其中,与划片一起形成用于排出与大气连通孔16连通的气泡的凹槽8。用于粘贴和堆叠单个芯片的生产线以及通过在这些基板上施加电压将这些基板彼此接合的过程。版权所有:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP2007106085A

    专利类型

  • 公开/公告日2007-04-26

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORP;

    申请/专利号JP20050302102

  • 发明设计人 SAKASHITA YUKI;

    申请日2005-10-17

  • 分类号B41J2/16;B41J2/045;B41J2/055;

  • 国家 JP

  • 入库时间 2022-08-21 21:12:13

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