Being the beveling wheel for silicon wafer rim section processing

摘要

PROBLEM TO BE SOLVED: To bevel a silicon wafer with high quality by eliminating the cause of pollution in beveling work of the wafer.;SOLUTION: The beveling wheel 10 is made up of a disk base metal 1 and by fixing an abrasive grain layer 2 with a groove on the outer periphery of the disk base metal 1. The base metal 1 is made of aluminum. The abrasive grain layer 2 consists of diamond abrasive grains having the concentrating degree of 100 in the grain size of #1,000, and of vitrified bond which is employed as a bonding material. A line of groove 3 is formed by electrical discharge machining. In the beveling wheel for silicon wafer outer periphery part machining, conductivity is applied by adding metallic powders containing none of copper, nickel and zinc to the vitrified bond, which leads to prevention of the metallic pollution to the wafer.;COPYRIGHT: (C)2003,JPO