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BASE RESIN FOR SOLDER FLUX, ROSIN BASED SOLDER FLUX AND SOLDER PASTE

机译:助焊剂,松香基助焊剂和焊膏的基础树脂

摘要

PROBLEM TO BE SOLVED: To provide a base resin for solder flux exhibiting an excellent base resin action and also having excellent thermal stability and low crystallinity by a simple process.;SOLUTION: The base resin for solder flux is a reaction product obtained by bringing denatured rosins (A) obtained by adding α, β-unsaturated carboxylic acids (a1) to natural rosins (a2) under Diels-Alder reaction at an addition rate of 10 to 80 mol% into disproportionation in the presence of a dehydrogenation catalyst (B), and also comprises dehydroabietic acid of 10 to 60 wt.% and α, β-unsaturated carboxylic acid-denatured pimaric acid of 10 to 70 wt.%.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:通过简单的方法提供具有优异的基础树脂作用并且还具有优异的热稳定性和低结晶度的用于助焊剂的基础树脂;解决方案:助焊剂的基础树脂是通过变性而获得的反应产物。松香(A)是在Diels-Alder反应下以10至80 mol%的加成率将α,β-不饱和羧酸(a1)添加到天然松香(a2)中,并在脱氢催化剂( B),并且还包含10至60 wt。%的脱氢松香酸和10至70 wt。%的α,β-不饱和羧酸改性的海松酸。版权所有:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP2007111735A

    专利类型

  • 公开/公告日2007-05-10

    原文格式PDF

  • 申请/专利权人 ARAKAWA CHEM IND CO LTD;

    申请/专利号JP20050305228

  • 发明设计人 KAJITA KAZUNARI;

    申请日2005-10-20

  • 分类号B23K35/363;

  • 国家 JP

  • 入库时间 2022-08-21 21:11:08

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