首页> 外国专利> In regard to pipe arrangement inside the device null pipe arrangement strength basic material which resolution treats the organicity

In regard to pipe arrangement inside the device null pipe arrangement strength basic material which resolution treats the organicity

机译:对于设备内部的管道布置,空管布置强度要考虑有机性的基础材料

摘要

PROBLEM TO BE SOLVED: To efficiently decompose org. compd. included in a fluid by utilizing oxidation-reduction reaction of a photo-catalyst alone in a pipeline and additionally to miniaturize an apparatus and to decrease manufacturing cost by using jointly an anti-fungal metal and the photo-catalyst. SOLUTION: Transparent cylindrical bodies 4 on the surfaces of which a photo-catalyst 5 alone and an anti-fungul metal are stuck are combined in multiple stages in a pipeline strength matrix 1 and light emitting end faces of optical fibers 11a are arranged on the inner wall face 1a of the pipeline strength matrix 1 and on the outside of the transparent cylindrical bodies 4 and 8 and a fluid to be treated is made to flow in the pipeline strength matrix 1 and an exciting light introduced into the pipeline strength matrix 1 through the optical fiber 11a is irradiated on the photo-catalyst 5 on the transparent cylindrical bodies 4 and 8 and nets 6 and 7 and by exciting thereby oxidation- reduction reaction and in addition, by acting the jointly used antifungal metal, org. compd. such as contaminants, bacteria and bad smell included in the fluid to be treated are continuously decomposed.
机译:要解决的问题:有效地分解组织。补偿。通过单独地在管道中利用光催化剂的氧化还原反应将其包含在流体中,并且另外通过将抗真菌金属和光催化剂一起使用来使装置小型化并降低制造成本。解决方案:仅将光催化剂5和抗真菌金属粘贴在其表面上的透明圆柱体4在管道强度矩阵1中分多个阶段组合,并且光纤11a的发光端面布置在内部使管道强度矩阵1的壁面1a和透明圆柱体4和8的外侧上,待处理的流体在管道强度矩阵1中流动,并且通过管道将激发光引入到管道强度矩阵1中。光纤11a被照射在透明圆柱体4和8以及网6和7上的光催化剂5上,并由此激发氧化还原反应,并且此外,通过使共同使用的抗真菌金属org起作用。补偿。被处理流体中所含的诸如污染物,细菌和难闻气味之类的污染物会持续分解。

著录项

  • 公开/公告号JP3981477B2

    专利类型

  • 公开/公告日2007-09-26

    原文格式PDF

  • 申请/专利权人 シンワ工業株式会社;

    申请/专利号JP19980267659

  • 发明设计人 山口 政明;

    申请日1998-09-22

  • 分类号C02F1/32;A61L2/02;A61L2/10;A61L9/20;B01J35/02;C02F1/72;

  • 国家 JP

  • 入库时间 2022-08-21 21:10:56

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