FILM-LIKE ADHESIVE FOR DIE BONDING, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE USING THE ADHESIVE

摘要

PROBLEM TO BE SOLVED: To provide a die-attach film which allows a film having a dual function of a die-attach film and a dicing film to be applied to a wafer in mild conditions and a die-bonding adhesive having excellent heat and humidity resistance in a semiconductor assembling step.;SOLUTION: A resin composition has a moisture absorption rate of 1.5% or less and a permeability of 6,000 g/m² or more at 85°C and 85% for 24 hours. The composition has a glass transition temperature of -30°C to 60°C. The resin composition contains preferably an acrylic acid copolymer and epoxy resin, and can be used as the die-bonding adhesive.;COPYRIGHT: (C)2007,JPO&INPIT