Photo solder resist film is prepared from the composition and liquid photo solder resist composition

摘要

Liquid photo solder resist composition plating resistance and solder heat resistance is improved to minimize the reduction in developability of the epoxy compound in the drying process by the ultraviolet curable resin developable SOLVED alkaline aqueous solution, with excellent resolution to provide such. An ultraviolet curable resin developable with an aqueous alkaline solution, and the UV reactive acrylic monomer, an epoxy resin, a photopolymerization initiator, [SOLUTION] liquid photo solder resist composition comprises an organic solvent. The step of producing a reaction product having an acryl group is reacted with acrylic acid monomer cyanuric acid compound (a), the epoxy resin, the step epichlorohydrin reaction product with (a) It is an isocyanurate structure containing in the molecule be adjusted through the steps including and (b) a step of introducing an epoxy group and the addition of the acrylic group and two or more epoxy groups in one. None [Selection Figure]