PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE SOLDER RESIST COMPOSITION AND PHOTOSENSITIVE SOLDER RESIST FILM, AND PERMANENT PATTERN, FORMATION METHOD THEREFOR AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive composition or the like that is excellent in insulation performance, plating resistance, and smoothness of a resist pattern side face.;SOLUTION: A photosensitive composition contains: a compound containing at least one of a group that can react with a radical and a group that can react with a heat crosslinking agent, and a triazole ring; a polymerizable compound; a photopolymerization initiator; and a heat crosslinking agent. It is preferable that the photosensitive composition further contains a carboxyl group-containing polymer compound. Preferably, the carboxyl group-containing polymer compound is an acid-modified ethylenically unsaturated group-containing polyurethane resin.;COPYRIGHT: (C)2013,JPO&INPIT