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Method of gas supply device and gas supply for semiconductor manufacturing equipment

机译:气体供应装置的方法以及用于半导体制造设备的气体供应

摘要

PROBLEM TO BE SOLVED: To downsize the apparatus and reduce the manufacturing cost and maintenance control cost by grouping the same or a plurality of kinds of gases to be fed to a semiconductor device so that the gas in one group is fed to the semiconductor device economically through one flow rate controller. ;SOLUTION: Required gases are fed from gas feeders A1 to A3 to various processes B1 to B3 executed in a process reactor R.R forming a part of a semiconductor manufacturing apparatus. For the process B1 e.g. in the reactor R.R, a gas feed valve V1 is opened and gas feed valves V2, V3 are closed, and gases in gas feed sources G1 to G4 are switched and fed from a gas supply A1 one after another into the reactor R.R, wherein the gases from the feed sources G1 to G4 are sent to the gas feed valve V1 through gas feed side valves VG1 to VG4 via one flow rate controller FRC and a gas take-out hole F1.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:通过将要供给到半导体器件中的相同或多种气体进行分组,以使装置的尺寸减小并降低制造成本和维护控制成本,从而将一组气体以经济的方式供给到半导体器件。通过一个流量控制器。 ;解决方案:所需的气体从供气器A1到A3馈送到在形成半导体制造设备一部分的过程反应器R.R中执行的各种过程B1到B3。对于过程B1在反应器RR中,打开进气阀V1,关闭进气阀V2,V3,并且切换进气源G1至G4中的气体,并将其从气体供应器A1一个接一个地供应到反应器RR中,其中来自进料源G1至G4的气体通过一个流量控制器FRC和出气孔F1通过进料侧阀VG1至VG4被输送到进料阀V1。版权所有:(C)2000,JPO

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