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Method of forming the insulating protective film to the plane of the nitride semiconductor layer and the side of the stripe waveguide nitride semiconductor laser device

机译:在氮化物半导体层的平面和条纹状波导氮化物半导体激光元件的侧面形成绝缘保护膜的方法

摘要

PROBLEM TO BE SOLVED: To provide a high insulation film on the surface of a p-side clad layer by forming an insulation film of other than Si oxide on the opposite side faces of a stripe in a stripe waveguide and on the plane of a nitride semiconductor layer continuous to the side face and then providing an electrode on the surface of a contact layer through that insulation film. ;SOLUTION: A first stripe protective film is formed on a p-side contact layer 13 and etched to form a waveguide region. A second insulating protective film 62 of other than Si oxide different from the material of the first protective film is then formed on the side face of the stripe waveguide and the plane of a nitride semiconductor layer exposed by etching. Since the first protective film is made of a material different from that of the second protective film 62, it exhibits selectivity to the second protective film for an etching means. Since the second protective film 62 can be formed continuously both on the surface of a p-type clad 12 and the side face of the stripe, high insulation can be sustained.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:通过在条形波导的条带的相对侧面上和氮化物平面上形成除氧化硅之外的绝缘膜,从而在p侧覆盖层的表面上提供高绝缘膜。半导体层与侧面连续,然后通过该绝缘膜在接触层的表面上提供电极。解决方案:在p侧接触层13上形成第一条纹保护膜,并对其进行蚀刻以形成波导区域。然后在条纹波导的侧面和通过蚀刻暴露的氮化物半导体层的平面上形成不同于Si氧化物的不同于第一保护膜的材料的第二绝缘保护膜62。由于第一保护膜由与第二保护膜62不同的材料制成,因此对于蚀刻装置,其对第二保护膜表现出选择性。由于第二保护膜62既可以在p型覆层12的表面上也可以在条带的侧面上连续形成,所以可以保持高绝缘性。版权所有:(C)2000,JPO

著录项

  • 公开/公告号JP3893614B2

    专利类型

  • 公开/公告日2007-03-14

    原文格式PDF

  • 申请/专利权人 日亜化学工業株式会社;

    申请/专利号JP20020240432

  • 发明设计人 佐野 雅彦;中村 修二;

    申请日2002-08-21

  • 分类号H01S5/042;H01S5/223;H01S5/323;

  • 国家 JP

  • 入库时间 2022-08-21 21:08:49

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