首页> 外国专利> PROCESS FOR MANUFACTURING A PHASE CHANGE SELECTION DEVICE WITH REDUCED CURRENT LEAKAGE, AND PHASE CHANGE SELECTION DEVICE, IN PARTICULAR FOR PHASE CHANGE MEMORY DEVICES

PROCESS FOR MANUFACTURING A PHASE CHANGE SELECTION DEVICE WITH REDUCED CURRENT LEAKAGE, AND PHASE CHANGE SELECTION DEVICE, IN PARTICULAR FOR PHASE CHANGE MEMORY DEVICES

机译:制造具有减小的电流泄漏的相变选择设备和相变选择设备的过程,特别是用于相变存储器设备

摘要

In a phase change memory including an ovonic threshold switch, conduction around the phase change material layer in the ovonic threshold switch is reduced. In one embodiment, the reduction is achieved by undercutting the conductive layers on either side of the phase change material layer. In another embodiment, an angled ion implantation is carried out which damages the edge regions of the conductive layers that sandwich the phase change material layer.
机译:在包括卵形阈值开关的相变存储器中,在卵形阈值开关中的相变材料层周围的传导减少。在一个实施例中,通过在相变材料层的任一侧上底切导电层来实现减小。在另一实施例中,进行成角度的离子注入,该成角度的离子注入损坏夹在相变材料层之间的导电层的边缘区域。

著录项

  • 公开/公告号US2007158698A1

    专利类型

  • 公开/公告日2007-07-12

    原文格式PDF

  • 申请/专利权人 CHARLES DENNISON;JOHN PETERS;

    申请/专利号US20060612962

  • 发明设计人 JOHN PETERS;CHARLES DENNISON;

    申请日2006-12-19

  • 分类号H01L29/768;

  • 国家 US

  • 入库时间 2022-08-21 21:07:07

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