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Semiconductor chip package with attached electronic devices, and integrated circuit module having the same
Semiconductor chip package with attached electronic devices, and integrated circuit module having the same
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机译:具有附接的电子装置的半导体芯片封装以及具有该半导体芯片封装的集成电路模块
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摘要
Provided are a semiconductor chip package with attached electronic devices, and an integrated circuit module having the same. The semiconductor chip packages may include a supporting substrate, input/output bonding pads arranged on a first plane of the supporting substrate, and device bonding pads arranged on the edges of the first plane or portions of the first plane adjacent to the edges. Accordingly, the mount area of a printed circuit board may be reduced, efficient routing may be possible, and the occurrence of package cracks may be reduced and/or prevented.
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