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Method of Forming a Metal Line and Method of Manufacturing a Display Substrate by Using the Same

机译:形成金属线的方法和使用其的显示基板的制造方法

摘要

In a method of forming a metal line and a method of manufacturing a display substrate, a channel layer and a metal layer are successively formed on a base substrate. A photoresist pattern is formed in a wiring area. The metal layer is etched by using the photoresist pattern to form a metal line. The photoresist pattern is removed by a predetermined thickness to form a residual photoresist pattern on the metal line. The channel layer is etched by using the metal line to form an undercut under the metal line. The protruding portion of the metal line is removed by using the residual photoresist pattern. The protruding portion relatively protrudes by formation of the undercut. Thus, an aperture ratio is increased, an afterimage is prevented, and the display quality is improved.
机译:在形成金属线的方法和制造显示基板的方法中,在基底基板上依次形成沟道层和金属层。在布线区域中形成光致抗蚀剂图案。通过使用光致抗蚀剂图案蚀刻金属层以形成金属线。去除光致抗蚀剂图案预定厚度,以在金属线上形成残留的光致抗蚀剂图案。通过使用金属线蚀刻沟道层以在金属线下方形成底切。通过使用残留的光刻胶图案去除金属线的突出部分。突出部分通过底切的形成而相对突出。因此,增加了开口率,防止了残像,并且提高了显示质量。

著录项

  • 公开/公告号US2007249096A1

    专利类型

  • 公开/公告日2007-10-25

    原文格式PDF

  • 申请/专利权人 JANG-SOO KIM;SANG-GAB KIM;

    申请/专利号US20070669551

  • 发明设计人 SANG-GAB KIM;JANG-SOO KIM;

    申请日2007-01-31

  • 分类号H01L21/00;

  • 国家 US

  • 入库时间 2022-08-21 21:06:09

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