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Accelerated B-Stage curing process for thermosetting resins and FBGA assembly process utilizing the accelerated B-Stage curing process
Accelerated B-Stage curing process for thermosetting resins and FBGA assembly process utilizing the accelerated B-Stage curing process
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机译:用于热固性树脂的加速B-阶段固化工艺和利用加速B-阶段固化工艺的FBGA组装过程
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摘要
An accelerated B-Stage curing process for thermosetting resins and an FBGA assembly process utilizing the accelerated B-Stage curing process in the manufacture of semiconductor devices are disclosed. In an accelerated B-Stage curing process for thermosetting resins, the thermosetting resin is subjected to a heat treatment procedure which is characterized by a predefined treatment temperature and a predefined treatment time, the treatment time comprising a treatment ramp-up time for ramping up resin temperature from current temperature to treatment temperature and a treatment dwell time for holding treatment temperature, the treatment temperature being in the range of over 130 to 190° C., preferably in the range of 150 to 170° C., most preferred in the range of 155 to 165° C. Experience shows that it is beneficial to select the treatment ramp-up time from the range of 1 to 20 min, preferably from the range of 5 to 15 min and most preferred from the range of 6 to 10 min. It is furthermore beneficial to select the treatment dwell time from the range of 15 sec to 12 min and preferably to set treatment dwell time to 1 min.
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