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Semiconductor image sensing element and fabrication method therefor, and semiconductor image sensing device and fabrication method therefor

机译:半导体图像感测元件及其制造方法,半导体图像感测装置及其制造方法

摘要

A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.
机译:半导体图像感测元件具有半导体元件,该半导体元件包括图像感测区域,外围电路区域,设置在外围电路区域中的多个电极部分,以及设置在图像感测区域上的多个微透镜以及具有以下结构的光学构件:至少覆盖图像感测区域并通过透明结合构件结合在微透镜上的构造。光学构件的侧表面区域形成有遮光膜,用于防止来自侧表面区域的反射光束或散射光束照射图像感测区域。

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