Multi-layer printed circuit board with through hole, electronic device, and method for manufacturing multi-layer printed circuit board with through hole

摘要

The invention provides a multi-layer printed circuit board with a through hole having a connection formed by filling conductive paste in the through hole, wherein the voltage of a circuit having constant current flow is stabilized. The circuit board comprises a closed circuit that starts from a power supply terminal and passes a power supply line, a connection connecting the patterns on the front and rear surfaces of the board, a load and a ground line to reach an earth terminal, wherein if the voltage drop at the connection exceeds a value determined based on a predetermined rate with respect to the power supply voltage, all or some of the connections is replaced with a jumper wire so that the voltage drop at the connection is equal to or smaller than a value determined by said predetermined rate, according to which the voltage level of the power supply line and the ground line is stabilized.