Method for Forming Via Holes Flexible Multi-layer Printed Circuit Board AND Method for MANUFACTURING Flexible Multi-layer Printed Circuit Board

摘要

A via hole forming method, a multilayer flexible printed circuit board, and a method of manufacturing the same. According to the present invention, there is provided a via hole forming method for forming a via hole for a printed circuit board, the method comprising: a removable material positioning step of placing a removable material through a post-treatment process at a target via hole formation position on the substrate layer; An additional substrate layer forming step of forming at least one additional substrate layer, and a via hole forming step of forming a via hole by removing the removable material through the post-processing step after the additional substrate layer forming step is performed.