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SEMICONDUCTOR DEVICE HAVING LOW RESISTANCE CONTACT TO P-TYPE SEMICONDUCTOR LAYER OF A WIDE BAND GAP COMPOUND AND METHOD FOR MANUFACTURING THE SAME
SEMICONDUCTOR DEVICE HAVING LOW RESISTANCE CONTACT TO P-TYPE SEMICONDUCTOR LAYER OF A WIDE BAND GAP COMPOUND AND METHOD FOR MANUFACTURING THE SAME
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机译:与宽带隙化合物的P型半导体层具有低电阻接触的半导体器件及其制造方法
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摘要
A semiconductor device having low resistance contact to p-type semiconductor layer of a wide band gap compound and a method for manufacturing the same are provided. The semiconductor device includes a p-type semiconductor layer of a GaN based compound formed on a substrate, a p-type carbon nanotube layer, and a metal contact. The p-type carbon nanotube layer is joined to the p-type semiconductor layer of the GaN based compound, and the metal contact is joined to the p-type carbon nanotube layer.
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