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Semiconductor package with exposed heat sink and the heat sink thereof
Semiconductor package with exposed heat sink and the heat sink thereof
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机译:具有裸露的散热器的半导体封装及其散热器
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摘要
A semiconductor package with an exposed heat sink and the heat sink thereof are proposed. A carrier having a first surface and a second surface is provided. At least one chip is mounted on the first surface of the carrier and electrically connected to the carrier. A heat sink includes a flat portion having an exposed surface, and a support portion extended peripherally from the flat portion and attached to the first surface of the carrier, wherein the flat portion, the support portion and the carrier form a space where the chip is received, and the flat portion is peripherally formed with a stepped structure having at least one flash preventing groove located at a position adjacent to the exposed surface so as to prevent resin flashes on the exposed surface of the heat sink during a molding process for forming an encapsulant that encapsulates the chip.
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