Flat package with exposed heat sink, for semiconductor chip - where heat sink and connector tags are made from single metal strip

摘要

A semiconductor chip is placed on a heat sink, and is joined by bonding wires to rows of external conductor tags, A flat and square block of insulating material is used to insulate the bonding wires from the heat sink, which is visible on the underside of the package. At least two opposite sides of the heat sink are each provided with a two-forked tongue providing an electrical connection to the heat sink. The semiconductor chip is pref. surrounded by four rows with equal numbers of connector tags, on two sides, a tongue is located in the middle, or the row to connect the heat sink. The insulating block is pref. a moulded thermosetting resin. All tags and the heat sink can be made from a single metal strip by stamping or etching the latter.