首页>
外国专利>
Dual pitch contact pad footprint for flip-chip chips and modules
Dual pitch contact pad footprint for flip-chip chips and modules
展开▼
机译:双节距接触垫占位面积,用于倒装芯片和模块
展开▼
页面导航
摘要
著录项
相似文献
摘要
An electronic device, including: a plurality of contacts pads on a surface of a substrate; the contacts pads spaced apart a first predetermined distance in a first direction; and the contact pads spaced apart a second predetermined distance in a second direction, the first predetermined distance different from the second predetermined distance, the first direction perpendicular to the second direction.
展开▼