首页>
外国专利>
High performance amine based no-flow underfill materials for flip chip applications
High performance amine based no-flow underfill materials for flip chip applications
展开▼
机译:高性能胺基无流动底部填充材料,用于倒装芯片应用
展开▼
页面导航
摘要
著录项
相似文献
摘要
Amine-based no-flow underfill materials and a method to produce flip-chip devices electrically bonded to a substrate are described. The no-flow underfill material includes an amine-based curing agent and a fluxing agent, which activates at a fluxing temperature and is neutral at the temperatures lower than the fluxing temperature. The fluxing agent of the no-flow underfill material heated to the activation temperature generates a reactive acid in-situ during chip attachment process to facilitate joint formation. The no-flow underfill material is formed on the substrate. A chip is placed on the no-flow underfill material formed on the substrate. A temperature is increased to activate the fluxing agent. The temperature is further increased to form conductive joints between the chip and the substrate. Further, the no-flow underfill material is cured. The conductive joints between the chip and the substrate may be lead-free.
展开▼