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Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling

机译：基于加速热循环的倒装芯片陶瓷球栅阵列不同底部填充材料的比较研究

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Z. Kornain; A. Jalar; N. Amin; R. Rasid; C. S. Foong;
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年度 2010
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1. Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling | Science Publications [J] . A. Jalar, C. S. Foong, N. Amin, American journal of engineering and applied sciences . 2010,第1期

机译：基于加速热循环的倒装芯片陶瓷球栅阵列上不同底部填充材料的比较研究科学出版物
2. Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package [J] . Z. Kornain, A. Jalar, R. Rasid, Journal of Electronic Packaging . 2010,第4期

机译：倒装芯片塑料球栅阵列封装中酚基和胺基底部填充材料的比较研究
3. Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling [J] . S. B. Park, Rahul Joshi, Izhar Ahmed, Journal of Electronic Packaging . 2008,第4期

机译：功率和加速热循环条件下相同形状系数的塑料和陶瓷球栅阵列封装焊点可靠性的比较研究
4. Thermal Behavior Analysis of Lead-free Flip-Chip Ball Grid Array Packages with Different Underfill Material Properties [C] . HU Youbiao, CAI Shengyun, DING Jianhua Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008) . 2008

机译：不同底部填充材料特性的无铅倒装芯片球栅阵列封装的热行为分析
5. Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic lead-tin and lead-free solders. [D] . Huang, Xingjia. 2003

机译：用共晶铅锡和无铅焊料对塑料球栅阵列，芯片规模和倒装芯片封装的焊球剪切强度进行调查和分析。
6. Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests [O] . Chang-Chun Lee 2017

机译：晶圆级底部填充对热循环测试过程中超薄芯片堆叠式3D-IC组件微凸点可靠性的影响
7. Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling [O] . Z. Kornain, A. Jalar, N. Amin, 2010

机译：基于加速热循环的倒装芯片陶瓷球栅阵列上不同底部填充材料的比较研究

Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling

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