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Low cost and low dishing slurry for polysilicon CMP
Low cost and low dishing slurry for polysilicon CMP
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机译:用于多晶硅CMP的低成本和低碟状浆料
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摘要
Methods and compositions are provided for planarizing substrate surfaces with low dishing. Aspects of the invention provide methods of using compositions comprising an abrasive selected from the group consisting of alumina and ceria and a surfactant for chemical mechanical planarization of substrates to remove polysilicon.
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