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Development of Cu CMP Slurry with High Throughput and Low Dishing

机译：高通量低掺杂Cu Cmp浆料的研制

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Jianfen Jing; Yuchun Wang; Jian Zhang; Xinyuan Cai; Xucheng Wang; Yanting Xu; Fengjun Shi;
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1. Dependency of dishing on polish time and slurry chemistry in Cu CMP [J] . V. Nguyen, H. VanKranenburg, P. Woerlee Microelectronic Engineering . 2000,第1a4期

机译：凹陷对Cu CMP中抛光时间和浆料化学性质的依赖性
2. Cu CMP process development and characterization of Cu dishing with 1.8 μm Cu pad and 3.6 μm pitch in Cu/SiO_2 hybrid bonding [J] . Hu Zheng-Jun, Qu Xin-Ping, Lin Hong, Japanese journal of applied physics . 2019,第SH期

机译：Cu / SiO_2杂化键合中具有1.8μm铜焊盘和3.6μm间距的Cu凹陷的Cu CMP工艺开发和表征
3. Cu CMP process development and characterization of Cu dishing with 1.8 μm Cu pad and 3.6 μm pitch in Cu/SiO_2 hybrid bonding [J] . Hu Zheng-Jun, Qu Xin-Ping, Lin Hong, Japanese journal of applied physics . 2019,第SH期

机译：Cu / SiO_2混合粘合中的1.8μmCu垫Cu CMP工艺开发和Cu凹陷和3.6μm间距的表征
4. Development of Cu CMP Slurry with High Throughput and Low Dishing [C] . Jianfen Jing, Yuchun Wang, Jian Zhang, China Semiconductor Technology International Conference . 2013

机译：高通量低成膜Cu CMP浆料的开发
5. Development and performance analysis of several new CMP slurries for sub-30nm copper technologies. [D] . Surisetty, Charan Veera Venkata Satya. 2010

机译：几种用于30nm以下铜技术的新型CMP浆料的开发和性能分析。
6. Co-hydrolysis of hydrothermal and dilute acid pretreated populus slurries to support development of a high-throughput pretreatment system [O] . Michael H Studer, Simone Brethauer, Jaclyn D DeMartini, 2011

机译：水热和稀酸预处理的胡杨浆液的共水解以支持开发高通量预处理系统
7. Novel Slurry Injection System for Improved Slurry Flow and Reduced Defects in CMP [O] . Ara Philipossian, Len Borucki, Yasa Sampurno, 2016

机译：新型浆料注入系统改善了浆料流动和减少Cmp的缺陷
8. CMP flowsheet development for the separation of actinides from ICPP sodium-bearing waste using centrifugal contactors [R] . Law, J. D. , Herbst, R. S. , Rodriguez, A. M. 1995

机译：Cmp流程开发用于使用离心接触器从ICpp含钠废物中分离act系元素

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