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High frequency via with stripped semi-rigid cable

机译:高频通过剥皮的半刚性电缆

摘要

A high frequency coax via structure is configured with a stripped semi-rigid cable (no shield), and an inductive compensation loop to mitigate transition discontinuity between that via structure's center conductor and the pad to which the center conductor is connected. The performance of top-to-bottom microwave transitions at high frequencies (e.g., 1 to 12 GHz) for such boards is enhanced. A non-metallized via hole embodiment that is configured with surrounding ground vias provides a greater degree of compensation for connection pads associated with greater capacitance (such as those coupled to a component).
机译:高频同轴通孔结构配置有裸露的半刚性电缆(无屏蔽),以及感应补偿环路,用于缓解该通孔结构的中心导体和连接中心导体的焊盘之间的过渡不连续性。这种板在高频(例如1至12 GHz)下从顶部到底部的微波过渡性能得到增强。配置有周围的接地通孔的非金属化通孔实施例为与更大电容相关联的连接焊盘(例如与组件耦合的焊盘)提供了更高程度的补偿。

著录项

  • 公开/公告号US7186927B2

    专利类型

  • 公开/公告日2007-03-06

    原文格式PDF

  • 申请/专利权人 JOHN S GREELEY;

    申请/专利号US20040903534

  • 发明设计人 JOHN S GREELEY;

    申请日2004-07-30

  • 分类号H01R12/04;H05K1/11;

  • 国家 US

  • 入库时间 2022-08-21 20:59:57

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