GLASS LID, AND PACKAGE PROVIDED WITH SUCH A LID, FOR THE ENCAPSULATION OF ELECTRONIC COMPONENTS

摘要

The encapsulation lid comprises at least two glass layers of different compositions, a first layer called the bottom layer, which is continuous, and at least a second layer which is discontinuous and designed so as to define cavities or anfractuosities in this lid. Preferably, the glass layers other than the first layer are preferably formed from low-melting-point frits, thereby allowing such lids to be manufactured economically, without recourse to glass machining.