首页>
外国专利>
SEMICONDUCTOR DEVICE INCLUDING OPTIMIZED DRIVER LAYOUT FOR INTEGRATED CIRCUIT WITH STAGGERED BOND PADS
SEMICONDUCTOR DEVICE INCLUDING OPTIMIZED DRIVER LAYOUT FOR INTEGRATED CIRCUIT WITH STAGGERED BOND PADS
展开▼
机译:半导体器件,包括带有交错键合板的集成电路的优化驱动器布局
展开▼
页面导航
摘要
著录项
相似文献
摘要
An embodiment of an integrated circuit die with staggered bond pads and optimized driver layout includes a staggered array of bond pads with an outer ring of bond pads and an inner ring of bond pads. Driver/ESD circuit cells for the outer ring of bond pads are located to the outside of the bond pads (between the outer ring of bond pads and the nearest die edge). The driver/ESD cells for the inner ring of bond pads are located to the inside of the bond pads (between the inner ring of bond pads and the die core). The integrated circuit die is coupled to a lead frame via bond wires.
展开▼