首页> 外国专利> METHOD FOR MANUFACTURE OF ELECTROLYTIC COPPER FOIL, ELECTROLYTIC COPPER FOIL MANUFACTURED BY THE METHOD, SURFACE-TREATED COPPER FOIL MANUFACTURED USING THE ELECTROLYTIC COPPER FOIL, AND COPPER-CLAD LAMINATE MANUFACTURED USING THE ELECTROLYTIC COPPER FOIL OR SURFACE-TREATED COPPER FOIL

METHOD FOR MANUFACTURE OF ELECTROLYTIC COPPER FOIL, ELECTROLYTIC COPPER FOIL MANUFACTURED BY THE METHOD, SURFACE-TREATED COPPER FOIL MANUFACTURED USING THE ELECTROLYTIC COPPER FOIL, AND COPPER-CLAD LAMINATE MANUFACTURED USING THE ELECTROLYTIC COPPER FOIL OR SURFACE-TREATED COPPER FOIL

机译:电解铜箔的制造方法,用该方法制造的电解铜箔,使用电解铜箔制造的表面处理过的铜箔和使用电解或电沉积的铜箔层状超细铜粉加工

摘要

Disclosed is a method for manufacture of an electrolytic copper foil having a lower profile compared to a conventional, commercially available low-profile electrolytic copper foil and also having excellent mechanical strength, with good efficiency. The method may comprise electrolyzing a sulfate-type copper electrolyte solution containing a quaternary ammonium salt polymer having a cyclic structure and a chlorine to form the electrolytic copper foil, wherein the quaternary ammonium salt polymer to be added to the sulfate-type copper electrolyte solution is a DDAC polymer composed of two or more monomer units. Preferably, the quaternary ammonium salt polymer is a diaryldimethylammonium chloride having a number average molecular weight of 300 to 10000. Preferably, the sulfate-type copper electrolyte solution comprises bis(3-sulfopropyl)disulfide or 3-mercapto-1-propanesulfonic acid which has a mercapto group.
机译:公开了一种电解铜箔的制造方法,该电解铜箔的轮廓与常规的市售低剖面电解铜箔相比具有更低的轮廓,并且还具有优异的机械强度和高效率。该方法可以包括电解包含具有环状结构的季铵盐聚合物和氯的硫酸盐型铜电解质溶液以形成电解铜箔,其中要添加到硫酸盐型铜电解质溶液中的季铵盐聚合物是由两个或多个单体单元组成的DDAC聚合物。优选地,季铵盐聚合物是数均分子量为300至10000的二芳基二甲基氯化铵。优选地,硫酸盐型铜电解质溶液包含双(3-磺丙基)二硫化物或3-巯基-1-丙烷磺酸,其具有巯基团。

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