首页> 外国专利> Electrolytic copper foil obtained by the manufacturing method and a manufacturing method of an electrolytic copper foil, surface treated electrolytic copper foil obtained using the electrolytic copper foil, copper-clad laminate and printed circuit using the surface-treated electrodeposited copper foil plate

Electrolytic copper foil obtained by the manufacturing method and a manufacturing method of an electrolytic copper foil, surface treated electrolytic copper foil obtained using the electrolytic copper foil, copper-clad laminate and printed circuit using the surface-treated electrodeposited copper foil plate

机译:通过电解铜箔的制造方法和制造方法得到的电解铜箔,使用该电解铜箔得到的表面处理过的电解铜箔,覆铜层压板和使用该表面处理过的电沉积铜箔板的印刷电路

摘要

[PROBLEMS] Conventional market compared with low-profile electrodeposited copper foil which has been supplied to, and to provide an electrolytic copper foil with a glossy further low profile. In order to solve A above problem, the surface roughness of the deposit side irrespective of the electrolytic copper foil thickness (Rzjis) is a ultra-low profile of less than 1.0μm, and, of the deposition surface gloss [Gs (60 °)] to the electrolytic copper foil is 400 or more. The electrolytic copper foil 3-mercapto-1-propanesulfonic acid and / or bis (3-sulfopropyl) disulfide and a sulfuric acid base copper obtained by adding the quaternary ammonium salt polymers and chlorine having a cyclic structure I obtained by electrolysis using an electrolytic solution. [Selection Figure] Figure 1
机译:[问题]与已供应的低轮廓电沉积铜箔相比,并且提供具有光泽的进一步低轮廓的电解铜箔的常规市场。为了解决上述问题,不管电解铜箔厚度(Rzjis)如何,沉积侧的表面粗糙度都是小于1.0μm的超低轮廓,并且沉积表面光泽度[Gs(60°)]电解铜箔的Δ为400以上。通过添加季铵盐聚合物和具有环状结构的氯获得的电解铜箔3-巯基-1-丙磺酸和/或双(3-磺丙基)二硫化物和硫酸基铜I 。 [选型图]图1

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