HEAT FOCUSING JIG FOR ANODIC BONDING, METHOD OF ANODIC BONDING AND APPARATUS THEREFOR

摘要

Heat focusing jig (15) consists of a material with electrical conductivity and heat transfer capability shaped into a plate and is provided on its one major surface with protrudent portions of roughly the same configuration as that of portions of junction of silicon wafer (11) and glass plate (12). The heat focusing jig (15), at the time of anodic bonding, is disposed either between heating means (14) and the silicon wafer (11) or between the heating means (14) and the glass plate (12). The protrudent portions are fitted and disposed in the portions of junction of the silicon wafer (11) or glass plate (12) and simultaneously abut on the silicon wafer (11) or glass plate (12).