Anodic bonding apparatus anodic bonding method, and anodic bonding jig,

摘要

Superposing the first substrate and the second substrate, the anodic bonding method to anodic bonding a first substrate and a second substrate, the first substrate and the second substrate to the plane of the base having a planar to be in contact with the substrate placement step of placed in contact the surface on which the cathode of the, the surface on which subsequent to the substrate placing step, the anode of the first substrate and the second substrate a jig arrangement step of placed in contact the anodic bonding jig having a visible portion of material visible light can transmit, the pair of marks provided on each of the first substrate and the second substrate to have a predetermined positional relationship, the alignment step of adjusting the relative positional relationship between the first substrate and the second substrate based on the visible light is transmitted through the visible part, the anode and the base a pressurizing step of sandwiching the second substrate pressurized, and the first substrate in the direction to be close to each other and the bonding jig, the applying step of applying a DC voltage between the first substrate and the second substrate I include a.