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Composite semiconductor light emitting device, LED head that employs the composite semiconcuctor device, and image forming apparatus that employs the LED head
Composite semiconductor light emitting device, LED head that employs the composite semiconcuctor device, and image forming apparatus that employs the LED head
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机译:复合半导体发光装置,采用该复合半导体装置的LED头以及采用该LED头的图像形成装置
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摘要
A composite semiconductor device includes a semiconductor thin film (20), a substrate (101), connection pads (103), and a light blocking layer (130, 451). The semiconductor thin film (20) includes light emitting elements. The driver circuits are formed on the substrate (101) and the semiconductor thin film is fixed on the substrate, the driver circuit driving the light emitting element. The connection pads (103) are formed on the substrate, electrical connection being made through which the connection pads. The light blocking layer (130, 451) is formed in an area between the light emitting element and the connection pad, the light blocking layer (130). The light blocking layer prevents light emitted from the light emitting element from reaching wires connected to the connection pad.
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