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Composite semiconductor light emitting device, LED head that employs the composite semiconcuctor device, and image forming apparatus that employs the LED head

机译:复合半导体发光装置,采用该复合半导体装置的LED头以及采用该LED头的图像形成装置

摘要

A composite semiconductor device includes a semiconductor thin film (20), a substrate (101), connection pads (103), and a light blocking layer (130, 451). The semiconductor thin film (20) includes light emitting elements. The driver circuits are formed on the substrate (101) and the semiconductor thin film is fixed on the substrate, the driver circuit driving the light emitting element. The connection pads (103) are formed on the substrate, electrical connection being made through which the connection pads. The light blocking layer (130, 451) is formed in an area between the light emitting element and the connection pad, the light blocking layer (130). The light blocking layer prevents light emitted from the light emitting element from reaching wires connected to the connection pad.
机译:复合半导体装置包括半导体薄膜(20),基板(101),连接焊盘(103)和遮光层(130、451)。半导体薄膜(20)包括发光元件。驱动器电路形成在基板(101)上,并且半导体薄膜固定在基板上,该驱动器电路驱动发光元件。连接垫(103)形成在基板上,通过该连接垫进行电连接。遮光层(130、451)形成在发光元件与连接垫即遮光层(130)之间的区域中。遮光层防止从发光元件发出的光到达连接到连接垫的电线。

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