DOUBLE FACE PLANE POLISHING MACHINE AND METHOD FOR POLISHING RECTANGULAR WORKPIECE

摘要

substrate receiving pocket portion is formed carrier, the horizontal line moving mechanism of the carrier, polishing pad rotation axis to the center as a pair of eccentric rectangular abrasive pad out from the central point, in parallel to a pair of the polishing surface of the polishing pad by a pair rectangles arranged to rotate in the other axis of the eccentric rectangular polishing pad, the polishing pad the lifting of the eccentric rectangular provides a double side polishing apparatus of the driving mechanism and the rotation mechanism, and a rectangular substrate having an abrasive liquid supply means for supplying a polishing solution to the substrate surface and the polishing pad is in contact with the eccentric rectangular housed in the substrate storage pockets. ; keep the rectangular substrate in the substrate receiving pocket portion of the carrier, by passing between the pair of the eccentric rectangular polishing pad rotation direction opposite to the substrate, the polishing of the rectangular substrate polishing the substrate at the same time on both sides of the rectangular method in, ; and make the eccentric rectangular abrasive pad of the pair parallel to the polishing surface arranged to rotate in the other axis, and also a certain amount of time to stop the rectangular substrate between the eccentric rectangular abrasive pad At the same time, rocking from side to side by the intermittent reciprocating linear movement of the carrier during polishing rectangular substrate provides a polishing method of polishing the surfaces of the rectangular substrate rectangular substrate.